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Neeyog Packaging to Showcase Biodegradable Cornstarch Solutions at IFE Manufacturing 2026
As food delivery and QSR operations continue to scale globally, performance under real food conditions has become critical. High-oil curries, steam-heavy meals, and extended delivery cycles demand packaging that maintains structural integrity without leakage or deformation.
At IFE 2026, we will introduce our Dinera Bio Cornstarch range — engineered specifically for high-heat and high-oil applications. The range offers:
• No oil leakage
• No heat distortion
• Strong structural performance through delivery cycles
• Fully compostable and food-safe solutions
We will also present newly developed vented formats designed to release steam while helping maintain food freshness for longer durations.
Neeyog Packaging works across paper, bagasse, and cornstarch-based materials, ensuring the right material is selected for the right food application.
We invite visitors to explore our innovations at Stand N111 and discover packaging engineered for real food conditions.
Eco-friendly. Engineered for real food.
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